• Resize textA -AA +
  • Dark Mode Icon
  • en English
    en English hi Hindi te Telugu

Engineering copper plasmonic chirality via ligand-induced dissolution for enantioselective recognition of amino acids.

Engineering copper plasmonic chirality via ligand-induced dissolution for enantioselective recognition of amino acids.

Maniappan, S., Dutta, C., Cheran, A., Solis, D. M., & Kumar, J. (2024). Engineering copper plasmonic chirality via ligand-induced dissolution for enantioselective recognition of amino acids. Chemical Science. DOI: 10.1039/D4SC00477A